 |
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Simultaneous lamination without adhesive
is possible. |
|
|
Low permittivity, low dielectric constant |
|
|
Good linear thermal expansion coefficient
in thickness direction. |
|
|
Has rigidity after lamination |
|
|
High density without inclusion of glass
fiber cloth |
|
|
Fine pitch drilling and laser drilling fabrication possible. |
|
|
Plating with the system for general purpose system is
possible. |
|
|
Can be bonded to metal without adhesive |
|
|
Heat resistance for lead-free soldering process |
 |
High density and high multilayer printed circuit
board |
| |
|
|
SIP (Single Chip Package) circuit board |
|
|
|
High speed multi
-pin count LSI package |
| |
|
|
Metal based circuit board |
|
|
|
 |
|
| Film |
|
 |
|
| Single-sided copper-laminated board |
|
 |
|
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|
